Buy Now, In-Store Pick Up Only

  • Front cover_Thermal Stress and Strain in Microelectronics Packaging
Free Preview of Thermal Stress and Strain in Microelectronics Packaging

Thermal Stress and Strain in Microelectronics Packaging

Edited by John Lau
Apr 30, 2012
$220.95
Online pricing. Prices and offers may vary in store.
.
.    Learn More
This product requires a minimum order of  1
Final Sale. No returns or exchanges.
This item will be shipped by appointment through our delivery partner.

Ship to me

Checking availability…

Buy now & pick up in store

Checking availability…

Find it in store

Checking availability…

Earn 1,105 points and enjoy extra savings with plum+. 

Overview

Appropriate for
Language
No. of Pages
884
Publisher: Springer US
Shipping dimensions: 9" H x 6" W x 2" L
ISBN: 9781468477696
Life stage: null

You May Also Like

Ratings & Reviews

  • bvseo_sdk, dw_cartridge, 18.2.0, p_sdk_3.2.0
  • CLOUD, getReviews, 5ms
  • reviews, product
  • bvseo-msg: Unsuccessful GET. status = 'ERROR', msg = 'Not Found.'; Unsuccessful GET. status = 'ERROR', msg = 'Not Found.';

Editorial reviews

john lau

Author

Others Also Bought

Thermal Stress and Strain in Microelectronics Packaging 048998E0-B4A6-4D37-8A62-96B1F9254E67
Thermal Stress and Strain in Microelectronics Packaging
https://dynamic.indigoimages.ca/v1/books/books/1468477692/1.jpg
220.95
Thermal Stress and Strain in Microelectronics Packaging
https://dynamic.indigoimages.ca/v1/https://cdn.kobo.com/book-images/20f0af31-37dd-48a5-be14-2c6a9e9bf5c4/300/300/False/image.jpg
210.23