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Front cover

Semiconductor Advanced Packaging
John H. Lau Hardcover
$262.95
2 formats available
Front cover

Solder Joint Reliability: Theory and applications
John H Lau Hardcover
$285.95
2 formats available
Front cover

Heterogeneous Integrations
John H. Lau Hardcover
$262.95
2 formats available
Front cover

Fan-out Wafer-level Packaging
John H. Lau Hardcover
$248.50
3 formats available
Front cover

Assembly And Reliability Of Lead-free Solder Joints
John H. Lau Paperback
$189.95
3 formats available
Front cover

Semiconductor Advanced Packaging
John H. Lau Paperback
$175.50

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
John H. Lau Kobo eBook
$217.99 Price reduced from $271.98 to
2 formats available

Chiplet Design and Heterogeneous Integration Packaging
John H. Lau Kobo eBook
$153.99 Price reduced from $191.98 to
2 formats available
Front cover

Heterogeneous Integrations
John H Lau Paperback
$155.95
Front cover

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
John H. Lau Paperback
$72.95
Front cover

Chiplet Design and Heterogeneous Integration Packaging
John H. Lau Paperback
$204.50
Front cover

Handbook of Tape Automated Bonding
John H Lau Hardcover
$285.95

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