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Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (a 4-volume Set)

Avram Bar-Cohen Edited by Jeffrey C Suhling , Andrew A O Tay
Oct 18, 2019
$1,971.50
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Overview

Appropriate for
Language
English
No. of Pages
1,080
Publisher: World Scientific Publishing
Shipping dimensions: 1" H x 1" W x 1" L
ISBN: 9789811201110
Life stage: null

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jeffrey c suhling

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