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Reliability, Yield, and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing & Software Development

Way Way Kuo , Wei-Ting Wei-Ting Kary Chien , Taeho Taeho Kim
Mar 14, 2014
$220.95
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Overview

Appropriate for
Language
No. of Pages
394
Publisher: Springer US
Shipping dimensions: 9" H x 6" W x 1" L
ISBN: 9781461375968
Life stage: null

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