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Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices

Edited by Xingyou Tian
Dec 11, 2023
$246.00
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Overview

Appropriate for
Language
English
No. of Pages
368
Publisher: Wiley
Shipping dimensions: 10" H x 7" W x 1" L
ISBN: 9783527352425
Life stage: null

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