Radiometric Temperature Measurements: II. Applications

Zhuomin M. Zhang
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Radiometric Temperature Measurements: II. Applications

Zhuomin M. Zhang
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Found in: Science & Nature, General Science

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Overview

480 PAGESENGLISH

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  • Published date: Nov 18, 2021
  • Language: English
  • No. of Pages: 480
  • Publisher: Academic Press Incorporated
  • ISBN: 9780123750914
  • Dimensions: 6.0" W x 1.0" L x 9.0" H
From 1993 until 2023 Benjamin Tsai worked as a physical scientist at NIST (National Institute of Standards and Technology) with research projects including the spectral irradiance scale, rapid thermal processing of semiconductor devices, heat flux, skin reflectance, UV exposure of reflectance standards, and photometry (measurement assurance program and research for luminous flux of LEDs).

"This reviewer was impressed by the scope and depth of coverage afforded to this rapidly developing and very important class of measurement techniques. Non-contact temperature measurement has many applications, as it avoids contamination of the measured material, can handle extremely high temperatures, and can usually (but not always) be a nonintrusive measurement method. Many of the pitfalls common in application of radiation thermometry are pointed out in these volumes, and methods for avoiding the common errors in application are given. These volumes should be a part of the library of anyone using radiation thermometry in engineering applications."--International Journal of Thermophysics

"This text is written for people using radiation thermometers in industry and scientific research and designing thermometers for particular applications. It provides summaries of recent practical applications at a level accessible to the novice but with sufficient technical depth to enable him or her to use them. It contains numerous up-to-date references for those readers wanting more details on a particular topic. Along with the first volume, it would be an excellent resource for researchers and engineers designing and using radiation thermometry devices."--IEEE Electrical Insulation Magazine

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