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Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications
Shichun Qu Couverture rigide
261,50 $
3 formats offerts
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Value in Business: A Holistic, Systems-based Approach to Creating and Achieving Value
Jeffrey Yi-lin Forrest Couverture souple
233,95 $
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Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing
Shen Liu Couverture rigide
218,95 $
2 formats offerts
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Value In Business: A Holistic, Systems-based Approach To Creating And Achieving Value
Jeffrey Yi-lin Forrest Couverture rigide
233,95 $
2 formats offerts
Couverture

Advances in Innovative Geotechnical Engineering: Proceedings of the 6th GeoChina International Conference on Civil & Transportation Infrastructures: From Engineering to Smart
Yong Liu Couverture souple
291,95 $
2 formats offerts
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New Polymeric Products: Fundamentals, Forming Methods and Applications
Yong Liu Couverture souple
370,50 $
2 formats offerts
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Stochastic Network Calculus
Yuming Jiang Couverture souple
80,50 $
2 formats offerts
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Electrospinning for Proton Exchange Membrane Fuel Cells
Yong Liu Couverture rigide
194,00 $
2 formats offerts

Electrospinning for Proton Exchange Membrane Fuel Cells
Yong Liu Livre numérique Kobo
155,99 $
2 formats offerts
Couverture

Tujia Paintings and Woodcarvings in Guizhou and Their Development in the Qing Dynasty
Yong Liu Couverture rigide
66,95 $
Couverture

Advances In Natural Computation, Fuzzy Systems And Knowledge Discovery: Volume 1
Yong Liu Couverture souple
321,50 $
2 formats offerts

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